Rumor mill: New retail packaging for Intel’s Eleventh-gen Rocket Lake CPUs has been noticed within the wild and stands out from earlier iterations. The arduous plastic bins have an odd form that may stand out on cabinets, which Intel seemingly hopes will improve hype round a era of chips they have to be profitable.
Intel Rocket Lake CPUs are slated to launch subsequent month. A brand new leak from VideoCardz has revealed the packing we are able to anticipate to come back with the top-of-the-line Core i9 chips. Primarily based on the leaked photographs, the brand new packaging is made solely, or a minimum of largely, of arduous plastic with opaque deep Intel blue on the back and front faces and translucent child blue home windows on the edges. The field seems to be like 4 trapezoids stacked front-to-back to present a glance that ought to stand out from the pack.
Intel’s tenth gen packaging featured a small acrylic window and harkened again to the oblong field design of eighth gen and earlier. This new field is extra in keeping with the stand-out-in-a-crowd angle that fed the design of the i9-9900k two years in the past.
In response to the leak, apparently the i9-11900KF will likely be given the standard cube-shaped remedy, so the arduous plastic field that may invariably function wall-hangings for a lot of tech youtubers will likely be restricted to solely essentially the most fanatic consumers.
Rocket Lake will likely be one more launch on the 14nm course of node, backported from the brand new Sunny Cove structure, which implies it would see plenty of enhancements and as much as 5.3GHz peak increase. That mentioned, the core counts on these playing cards look to path behind AMD’s present providing and Intel will want Rocket Lake to be successful as they work to repair their course of node points.
This new packaging will both rejoice a speedy new chip or attempt to gin up some curiosity (keep in mind the Marvel-themed Intel packaging?) in an organization below duress.